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INTEGRATED CIRCUITS
DATA SHEET
TDA8008 Dual multiprotocol smart card coupler
Objective specification File under Integrated Circuits, IC02 1999 Dec 14
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
FEATURES * 8xC51 core with 16 kbytes or EPROM (TDA8008), 256 bytes RAM, 512 bytes AUXRAM, Timer 0, 1, 2 and enhanced UART * Specific ISO 7816 UART, accessible with MOVX instructions for automatic convention processing, variable baud rate through frequency or division ratio programming, error management at character level for T = 0 protocol, extra guard time register * Dual VCC generation (5 V 5% or 3 V 5%), maximum current of 60 mA with controlled rise and fall times * Dual cards clock generation (up to 10 MHz) with two times synchronous frequency doubling * Cards clock STOP HIGH or LOW or 1.25 MHz (from an integrated oscillator) for cards power reduction mode * Automatic activation and deactivation sequences through an independent sequencer * Supports the asynchronous protocols T = 0 and T = 1 in accordance with ISO 7816 and EMV * Versatile 24-bit time-out counter for Answer To Reset (ATR) and waiting times processing * 22 ETU counter for block guard time * Supports synchronous cards * Current limitations on cards contacts * Special circuitry for killing spikes during power-on or off * Supply supervisor for Power-on reset * Step-up converter (supply voltage from 2.7 to 5.5 V at 16 MHz), doubler, tripler or follower according to VCC and VDD * Speed up to 25 MHz at VDD = 5 V * Additional I/O pin allowing the use of the ISO 7816 UART for an external card interface (pin IOAUX) * Additional interrupt pin allowing detection of level toggling on an external signal (pin INTAUX) * Fast and efficient swapping between the 3 cards due to separate buffering of parameters for each card ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8008HL LQFP80 DESCRIPTION
TDA8008
* Chip select input allowing use of several devices in parallel and memory space paging * Enhanced ESD protections on card contacts (6 kV min.) * Software library for easy integration within the application * Development tool with a TDA8007B and a regular emulator. APPLICATIONS * Multiple smart card readers for multiprotocol applications (EMV banking, digital pay TV, access control, etc.). GENERAL DESCRIPTION The TDA8008 is a complete, one-chip, low cost dual smart card coupler. It can be used as the kernel of a multiple card reader. It can handle all ISO 7816, EMV and GSM11-11 requirements. The integrated ISO 7816 UART and the time-out counters allow easy use even at high baud rates with no real time constraints. Due to its chip select and external I/O and interrupt features, it simplifies the realization of any number of cards reader. It gives the cards and the set a very high level of security, due to its special hardware against ESD, short-circuiting, power failure and overheating. Its integrated step-up converter allows operation within a supply voltage range of 2.7 to 5.5 V at 16 MHz. The OTP version of the TDA8008 allows fast and reliable software development and fast product introduction. A software library has been developed, that can handle all actions required for T = 0, T = 1 and synchronous protocols.
VERSION SOT315-1
plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
1999 Dec 14
2
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
QUICK REFERENCE DATA SYMBOL VDD IDD(pd) PARAMETER supply voltage CONDITIONS VDDD = VDDA = VDDP MIN. 2.7 - TYP. - -
TDA8008
MAX. 5.5 tbf
UNIT V A
supply current in Power-down mode VDD = 3.3 V; cards inactive; 8xC51 controller in power-down mode; note 1 supply current in sleep mode
IDD(sm)
VDD = 3.3 V; cards active at - VCC = 5V; clock stopped; 8xC51 controller in Idle mode; note 1 VDD = 3.3 V; fXTAL1 = 20 MHz VCC1 = VCC2 = 5 V; ICC1 + ICC2 = 80 mA; note 1 including static loads (5 V card) with 40 nAs dynamic loads on 200 nF capacitor (5 V card) including static loads (3 V card) with 40 nAs dynamic loads on 200 nF capacitor (3 V card) -
-
tbf
mA
IDD(om)
supply current in operating mode
-
tbf
mA
VCC
card output supply voltage
4.75 4.6 2.80 2.75 - - - 0.10 - - 3.5
5.0 5.0 3.0 3.0 - 80 - 0.16 - - - - -
5.25 5.4 3.20 3.25 65 - 80 0.22 100 225 25 25 +85
V V V V mA mA mA V/s s s MHz MHz C
ICC ICC1 + ICC2 SR tde tact fXTAL fop Tamb Note
card output supply current sum of both cards currents slew rate on VCC (rise and fall) deactivation cycle duration activation cycle duration crystal frequency operating frequency ambient temperature
operating overload detection CL = 300 nF (max.)
external frequency applied to pin XTAL1
0 -25
1. IDD in all configurations includes the current at pins VDDD, VDDA and VDDP.
1999 Dec 14
3
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
BLOCK DIAGRAM
TDA8008
handbook, full pagewidth
CDELAY
VDDD
GNDD
200 nF SBM SBP SAP
200 nF SAM 23
51 RESET RSTOUT 3 39
52
6 SUPPLY SUPERVISOR
18
24
25 16
VDDP GNDP VUP 200 nF
STEP-UP CONVERTER
17 26
EA/VPP PSEN ALE/PROG
65 63 64 75 to 80, 1, 2
8xC51 CONTROLLER 16 KBYTES ROM or OTP 256 BYTES RAM TIMER 0, 1 and 2 8 8 ENHANCED UART ISO 7816 UART TIME-OUT COUNTER
4 34 33 32 31 30 29 28 27 15 14 13 12 11 10 9 8 5 50 49
VDDA I/01 C81 PRES1 C41 RST1 VCC1 CLK1 GNDC1 GNDC2 CLK2 VCC2 RST2 C42 C82 I/02 PRES2 GNDA XTAL1 XTAL2
P10 to P17 41 to 48 P30 to P37
ANALOG
TDA8008
P20 to P27 53 to 62
CLOCK CIRCUITRY
DRIVERS AND SEQUENCER
512 BYTES AUXRAM BY MOVX
ALE P36/WR P37/RD INTAUX IOAUX CS 47 48 35 37 38
INTERFACE CONTROL
P00 to P07
67 to 74
XTAL OSCILLATOR INTERNAL OSCILLATOR 19 to 22, 40, 58, 59, 66 n.c.
36 7
TEST INHIB
FCE568
Fig.1 Block diagram.
1999 Dec 14
4
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
PINNING SYMBOL P16 P17 RESET PIN 1 2 3 8xC51 general purpose I/O port 8xC51 general purpose I/O port DESCRIPTION
TDA8008
reset input: a HIGH on this pin for 2 machine cycles while the oscillator is running, resets the device. An internal diffused resistor connected to GNDD permits a Power-on reset using an external capacitor connected to VDDD. analog supply voltage analog ground pin for an external delay capacitor test pin (must be left open-circuit in the application) card 2 presence contact input (active HIGH or LOW by mask option) data line to/from card 2 (ISO C7 contact) auxiliary I/O for ISO C8 contact for card 2 (i.e. synchronous cards) auxiliary I/O for ISO C4 contact for card 2 (i.e. synchronous cards) card 2 reset output (ISO C2 contact) card 2 output supply voltage (ISO C1 contact) clock output of card 2 (ISO C3 contact) ground for card 2 contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP and SAM) ground for the step-up converter contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP and SBM) not connected not connected not connected not connected supply voltage for the step-up converter contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP and SBM) contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP and SAM) output of the step-up converter ground for card 1 clock output of card 1 (ISO C3 contact) card 1 output supply voltage (ISO C1 contact) card 1 reset output (ISO C2 contact) auxiliary I/O for ISO C4 contact for card 1 (i.e. synchronous cards) card 1 presence contact input (active HIGH or LOW by mask option) auxiliary I/O for ISO C8 contact for card 1 (i.e. synchronous cards) data line to and from card 1 (ISO C7 contact) auxiliary interrupt input 5
VDDA GNDA CDELAY INHIB PRES2 IO2 C82 C42 RST2 VCC2 CLK2 GNDC2 SAM GNDP SBM n.c. n.c. n.c. n.c. VDDP SBP SAP VUP GNDC1 CLK1 VCC1 RST1 C41 PRES1 C81 IO1 INTAUX 1999 Dec 14
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
SYMBOL TEST IOAUX CS RSTOUT n.c. P30/RXD P31/TXD P32/INT0 P33/INT1 P34/T0 P35/T1 P36/WR P37/RD XTAL2 XTAL1 VDDD GNDD P20/A8 P21/A9 P22/A10 P23/A11 P24/A12 n.c. n.c. P25/A13 P26/A14 P27/A15 PSEN
PIN 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63
DESCRIPTION test pin (must be left open-circuit in the application) input or output for an I/O line issued on an auxiliary smart card interface chip select input (active LOW) open-drain output for resetting external chips not connected 8xC51 general purpose I/O port/serial input port 8xC51 general purpose I/O port/serial output port 8xC51 general purpose I/O port/external interrupt 0 8xC51 general purpose I/O port/external interrupt 1 8xC51 general purpose I/O port/Timer 0 external input 8xC51 general purpose I/O port/Timer 1 external input 8xC51 general purpose I/O port/external data memory write strobe 8xC51 general purpose I/O port/external data memory read strobe connection pin for an external crystal (output from the inverting oscillator amplifier) connection pin for an external crystal, or input for an external clock signal (input to the inverting oscillator amplifier and input to the internal clock generator circuits) digital supply voltage digital ground 8xC51 general purpose I/O port/address 8 8xC51 general purpose I/O port/address 9 8xC51 general purpose I/O port/address 10 8xC51 general purpose I/O port/address 11 8xC51 general purpose I/O port/address 12 not connected not connected 8xC51 general purpose I/O port/address 13 8xC51 general purpose I/O port/address 14 8xC51 general purpose I/O port/address 15 Program store enable output: this is the read strobe to the external program memory. When executing code from the external program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external data memory. PSEN is not activated during fetches from internal program memory. Address latch enable/program pulse: this is the output pulse for latching the low byte of the address during an access to external memory. In normal operation, ALE pulses are emitted at a constant rate of 16 of the oscillator frequency and can be used for external timing or clocking. It should be noted that one ALE pulse is skipped during each access to external data memory. This pin is also the program pulse input (PROG) during EPROM programming. ALE can be disabled by setting bit SFR Auxiliary 0. With this bit set, ALE will be active only during a MOVX instruction.
ALE/PROG
64
1999 Dec 14
6
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
SYMBOL EA/VPP
PIN 65
DESCRIPTION External access enable/programming supply voltage: EA must be externally held LOW to enable the device to fetch code from external program memory locations starting with 0000H. If EA is held HIGH, the device executes from the internal program memory unless the program counter contains an address greater than 3FFFH (16 kbytes boundary). This pin also receives the 12.75 V programming supply voltage (VPP) during EPROM programming. If security bit 1 is programmed, EA will be internally latched on reset. not connected 8xC51 general purpose I/O port/address/data 7 8xC51 general purpose I/O port/address/data 6 8xC51 general purpose I/O port/address/data 5 8xC51 general purpose I/O port/address/data 4 8xC51 general purpose I/O port/address/data 3 8xC51 general purpose I/O port/address/data 2 8xC51 general purpose I/O port/address/data 1 8xC51 general purpose I/O port/address/data 0 8xC51 general purpose I/O port/timer, counter 2 external count input and clock output 8xC51 general purpose I/O port/timer, counter 2 reload, capture and direction control 8xC51 general purpose I/O port 8xC51 general purpose I/O port 8xC51 general purpose I/O port 8xC51 general purpose I/O port
n.c. P07/AD7 P06/AD6 P05/AD5 P04/AD4 P03/AD3 P02/AD2 P01/AD1 P00/AD0 P10/T2 P11/T2EX P12 P13 P14 P15
66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
1999 Dec 14
7
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
TDA8008
44 P33/INT1
43 P32/INT0
P26/A14 61 P27/A15 62 PSEN 63 ALE/PROG 64 EA/VPP 65 n.c. 66 P07/AD7 67 P06/AD6 68 P05/AD5 69 P04/AD4 70 P03/AD3 71 P02/AD2 72 P01/AD1 73 P00/AD0 74 P10/T2 75 P11/T2EX 76 P12 77 P13 78 P14 79 P15 80 C82 10 C42 11 RST2 12 VCC2 13 CLK2 14 GNDC2 15 SAM 16 GNDP 17 SBM 18 n.c. 19 n.c. 20 1 2 3 4 5 6 7 8 9
41 P30/RXD 40 n.c. 39 RSTOUT 38 CS 37 IOAUX 36 TEST 35 INTAUX 34 IO1 33 C81 32 PRES1 C41 RST1 VCC1 CLK1 GNDC1 VUP SAP SBP 31 30 29 28 27 26 25 24 23 VDDP 22 n.c. 21 n.c.
FCE569
TDA8008HL
RESET
P16
P17
VDDA
GNDA
CDELAY
INHIB
PRES2
Fig.2 Pin configuration.
1999 Dec 14
IO2
8
42 P31/TXD
60 P25/A13
57 P24/A12
56 P23/A11
55 P22/A10
47 P36/WR
handbook, full pagewidth
48 P37/RD
54 P21/A9
53 P20/A8
46 P35/T1
45 P34/T0
50 XTAL1
49 XTAL2
52 GNDD
51 VDDD
59 n.c.
58 n.c.
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
PACKAGE OUTLINE LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
TDA8008
SOT315-1
c
y X A 60 61 41 40 Z E
e E HE wM bp 80 1 pin 1 index 20 ZD bp D HD wM B vM B vM A L 21 detail X Lp A A2 A1 (A 3)
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.16 0.04 A2 1.5 1.3 A3 0.25 bp 0.27 0.13 c 0.18 0.12 D (1) 12.1 11.9 E (1) 12.1 11.9 e 0.5 HD HE L 1.0 Lp 0.75 0.30 v 0.2 w 0.15 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7 0o
o
14.15 14.15 13.85 13.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT315-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-07-15
1999 Dec 14
9
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TDA8008
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Dec 14
10
Philips Semiconductors
Objective specification
Dual multiprotocol smart card coupler
Suitability of surface mount IC packages for wave and reflow soldering methods
TDA8008
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
1999 Dec 14
11
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/01/pp12
Date of release: 1999
Dec 14
Document order number:
9397 750 06532

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